DIRANSA塑料扩链和相容剂

Appearance外观

Clear powder清粉状

Solids (%)固含

>99

Tg (ºC)玻璃化温度

60

Epoxy equivalent weight (g/mol)环氧值

445

Operation操作

Procedure步骤

Pre-drying

预干燥

Pre-dry the base plastic at manufacturer’s recommended conditions.

推荐下预干燥基础塑料。

In some instances small amounts of THYOSIL CXP5045 can be compensated for poor or incomplete drying, thus bringing robustness and saving to your operations.

在某些情况下，添加少量的THYOSIL CXP5045可以补偿不良或不完全的干燥，从而为您的操作带来方便和节省操作。

Hygroscopicity: there is no evidence of bulk absorption of moisture over extended periods of time for THYOSIL CXP5045.

At normal conditions of temperature and relative humidity its surface reaches equilibrium saturation through adsorption at less than 0,25% of moisture.

At extreme conditions its surface reaches equilibrium saturation at less than 0,50% of moisture.

This means that THYOSIL CXP5045 can generally be processed without any drying, even after long exposure to drastic conditions bringing no more than 5ppm moisture per every 0,1% used.

吸湿性：THYOSIL CXP5045在长时间内没有大量吸收水分的迹象。在正常的温度和相对湿度条件下，其表面通过吸附小于0.25％的水分达到平衡饱和度。

在极端条件下其表面水分，在小于0.50％达到平衡饱和。这意味着即使经过长时间暴露于剧烈的条件下，THYOSIL CXP5045通常也可以进行加工处理，每0.1％使用不超过5ppm的水分。

Ins systems where moisture sensitivity is extreme, THYOSIL CXP5045 can be dried in a desiccant dryer ant 30°C for 1 hour, prior to use.

在潮湿敏感度极高的系统中，THYOSIL CXP5045可以在干燥剂干燥器中于30℃ 干燥1小时，然后再使用。

Extruder/injection molder temperature profile

挤出机/注塑机温度曲线

Where feeding solid THYOSIL CXP5045 in any solid form, except masterbatch, into the first zone of the extruder or infection molder, we recommend to operate this zone at 20°C to 40 °C lower temperature than normal. This will prevent early melting and agglomeration of the additive.

在将固体形式除母粒之外的固体THYOSIL CXP5045进入挤出机或感染模塑机的**区域内，建议比常温低 ，在20℃至40℃的温度下操作该区域。 这将防止添加剂的早期熔化和附聚。

All other zones should employ normal processing condition as recommended by the plastic’s manufacturer.

所有其他区域应采用塑料制造商推荐的正常加工条件。

Additive thermal stability

添加剂热稳定性

THYOSIL CXP5045 is thermally stable up to 320°C. Above this temperature additive decomposition may occur.

THYOSIL CXP5045在320°C以下是热稳定的。 高于此温度可能会发生分解。

Residence time

停留时间

THYOSIL CXP5045 reacts quickly. Its reaction will be over 99% complete if at least 3 min residence time is provided at 200°C in a well-mixed system. Alternatively, 45 sec residence time at 280°C will provide 99% completion.

THYOSIL CXP5045快速反应。 如果在200℃下在充分混合的系统中至少提供3分钟的停留时间，其反应将达到99％以上。 或者，在280℃下停留时间为45秒将完成99％。

These limits accommodate most extrusion and injection molding processed for the recommended thermoplastics and applications.

这些限制适用于为推荐的热塑性塑料和应用而加工的大多数挤出和注塑。

For use in polymerization reactors where residence time is over 5 minutes, see recommendations in section “Methods of Dosage”.

用于停留时间超过5分钟的聚合反应釜中，请参见“剂量方法”一节中的建议。